Interflux solder paste DP5505, Sn96.5Ag3.0Cu0.5 grain size type 5, 10cc cartridge, with flux ROL0

Interflux solder paste DP5505

The solder paste has been developed to minimize the “hidden pillow defect” when soldering BGAs.

Fields of application:
Manual dispensing with cartridge and cannula
Use in automatic dispensers

Properties:
No-clean
Halogen-free
Lead-free
Minimal and transparent flux residues
Reduced formation of cavities (voids)
The solder paste complies with IPC 7095, class 3 cavity formation

Alloy: Sn96.5Ag3.0Cu0.5
Grain size type 5
Form of delivery: 10cc cartridge
Flux: ROL0 no clean
Metal content: 87%
Melting point: 217°C
Contents: 30 g solder paste

Storage:
In closed original container at 3-7°C

Handling:
To avoid condensation, allow the solder paste to warm up slowly to room temperature before opening.

The technical data sheet can be found here under Documents.