Interflux solder paste DP5505

The solder paste has been developed to minimize the “hidden pillow defect” when soldering BGAs.

Fields of application:
Manual dispensing with cartridge and cannula
Use in automatic dispensers

Properties:
No-clean
Halogen-free
Lead-free
Minimal and transparent flux residues
Reduced formation of cavities (voids)
The solder paste complies with IPC 7095, class 3 cavity formation

Alloy: Sn96.5Ag3.0Cu0.5
Grain size type 5
Form of delivery: 10cc cartridge
Flux: ROL0 no clean
Metal content: 87%
Melting point: 217°C
Contents: 30 g solder paste

Storage:
In closed original container at 3-7°C

Handling:
To avoid condensation, allow the solder paste to warm up slowly to room temperature before opening.

The technical data sheet can be found here under Documents.