GALLUNOPTIMAL ISO-Core Sn99.25Cu0.7Ni0.05 (Sn100Ni+) lead-free solder wire for manual soldering in electronics, DIN EN ISO 9453:2014 with 2.2% flux filling Clear, halogen-containing <0.15% REL1 DIN EN ISO 9454-1, 1222, melting temperature 227°C, 1.5 mm, 500g spool

GALLUNOPTIMAL by FELDER ISO-Core Sn100Ni+ solder wire is a universal, lead-free solder wire for precise manual soldering work in electronics and electrical engineering with a very low halogen content <0.15%. It melts at approx. 227°C, consists of a very high proportion of tin with a microalloy of copper, nickel, and germanium, and complies with DIN EN ISO 9454-1, 1223. This offers excellent mechanical stability and minimized oxidation at the soldering tip.

Thanks to the 2.2% flux filling Clear according to REL1 standard (Rosin, Low Activity, Halogenated), it is ideally suited for almost all hand soldering applications and ensures good wetting of the solder joints, reliable soldering results and is optimized for work on electronic assemblies. Despite the low halogen content (<0.15%), there is generally no risk of corrosion after soldering, and the solder joint does not need to be cleaned.

Areas of application:

– Hand soldering work on printed circuit boards, SMD components, and solder joints
– Universal for general work on electronics and electrical engineering
– Reliable for repairs – suitable for assemblies, circuit boards, and aged solder joints
– Precise manual soldering work in model making, sensor technology, and industrial applications
– Good wetting and reliable solder joints with minimized oxidation

Scope of delivery:

1x GOCL050100Ni+, 1.5 mm diameter, 500 g spool GALLUNOPTIMAL by FELDER ISO-Core Sn100Ni+ (Sn99.25Cu0.7Ni0.05)