Ersa HR550L Hybrid Rework System – High-performance rework for professionals!
Version with extra-large board holder
The Ersa Hybrid Rework System HR 550L is designed for all users who demand the highest standards of precision and safety when reworking electronic assemblies. The HR 550 features a 1,900 W hybrid high-performance heating element that can be used to desolder and solder SMT components up to a size of 70 x 70 mm. The 2,400 W infrared bottom heating in three zones ensures homogeneous heating of the entire assembly. Non-contact and contact
temperature measurement on the component and optimized process control ensure
ideal desoldering and soldering processes. Component removal and placement is performed by a high-precision vacuum pipette integrated into the heating head. The replaceable
heating head and the vacuum pipette are each controlled by a stepper motor. An integrated force sensor detects contact with the component and circuit board.
Users will particularly appreciate the ergonomic arrangement of the controls and the computer-assisted component alignment based on high-contrast, high-resolution camera images.
The HR 550L is designed for use with the Ersa Dip&Print Station. The system is operated via newly developed operating software and ergonomically arranged controls on the device.
Technical highlights:
– 1,900 W hybrid high-performance heating element
– Full-surface 2,400 W IR bottom heating
– High-resolution cameras for placement and process monitoring
– Computer-assisted component alignment, digital “split optics”
– Ergonomically optimized system operation
– Modern, user-friendly operating software
Technical data:
– Dimensions (W x D x H): 573 x 765 x 545/747 mm (heating head bottom/top)
– Weight 55 kg
– Voltage 220-240 V AC, 50-60 Hz, 16 A
– Top heater data 70 x 70 mm, 100 W hot air + 900 W infrared
Top heater technology Hybrid heater with medium-wave infrared heaters and additional convection heating
– Bottom heater data 390 x 270 mm, 2,400 W in three zones
Bottom radiator technology Medium-wave infrared radiator with cover
– Max. PCB dimensions 520 x 360 mm
– Working depth 349 mm
– Working distance (typical) 30-60 mm to top heater
– 35 mm to bottom heating
– Component dimensions 0.6 x 0.6 to 70 x 70 mm
(Micro components up to 01005 with 0.4 x 0.2 mm are possible with additional accessories)
– Position laser class II
– Field of view placement camera 70 x 70 mm (wide angle) 25 x 33 mm (telephoto)
– HRSoft2 operating software – suitable for Windows
Supplied accessories:
– Holder for thermocouple – 0HR640
– AccuTC sensor without mounting – 0HR640
– Open-end wrench SW9 – 316569
– Knurled wrench SW9 – 316590
– 10 mm nozzle with 8 mm silicone suction cup – 0HR5520-80100
– 3.6 mm nozzle with 2.6 mm silicone suction cup – 0HR5520-26036
– Air deflector for HR550 30x30mm – 317166
– Air deflector for HR550 45x45mm – 320690
– Support rail with 2 pins – 0HR554-01
